Automatic wafer mapping in a wet environment on a wafer cleaner
US6356091B1 · kind B1 · utility
7Cited by
9References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 19, 1998 |
| Grant date | Mar 12, 2002 |
| Priority date | — |
| Expiry date | Nov 19, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/681
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer mapping method and apparatus for automatically determining the location and orientation of workpieces within a workpiece processing tool. An illumination device is provided which directs light toward the edges of the workpieces and a vision system is utilized to receive and process the images obtained from the light which is reflected off the edges of the workpieces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.