Connector assembly for testing memory modules from the solder-side of a PC motherboard with forced hot air
US6357023B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2000 |
| Grant date | Mar 12, 2002 |
| Priority date | — |
| Expiry date | Oct 30, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/141
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Memory modules are tested using a test assembly with a personal computer (PC) motherboard. The motherboard is mounted upside-down with its solder-side up to a metal plate using standoffs. A memory-module socket on the motherboard is removed. An opening is made in the metal plate above the removed socket. A well is attached to the metal plate at the opening. The well supports a test adaptor board below the metal plate so that the test adaptor board has a closer spacing to the motherboard than does the metal plate. The test adaptor board has a test socket that receives a module being tested. Pins from the test adaptor board are plugged into the holes of the removed socket on the motherboard, but mounted on the reverse, solder side of the motherboard rather than the component side. The cables, components, and expansion boards of the motherboards are hidden below the metal plate and motherboard, and can be cooled without cooling the memory module in the test socket. A top plate or air guide can be added above the metal plate to blow hot air on the memory module being tested in the test socket, while the cooling air is blown on the motherboard.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.