Methods and devices for positioning and bonding elements to substrates
US6357098B1 · kind B1 · utility
2Cited by
1References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 3, 1999 |
| Grant date | Mar 19, 2002 |
| Priority date | — |
| Expiry date | Dec 3, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53978
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Devices and techniques for placing and bonding identical elements to holes in a substrate where spacer balls and a reference surface are used to achieve the desired accuracy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.