Micromechanical sensor and method for producing the same
US6357299B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 1999 |
| Grant date | Mar 19, 2002 |
| Priority date | — |
| Expiry date | Aug 11, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R19/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A micromechanical sensor integrated on a chip, includes a semiconductor substrate, an electronic circuit, a void, a diaphragm, a counterelectrode and valve openings connecting a volume of the void to its surroundings. The valve openings are directed toward an upper surface of the wafer, and the counterelectrode is a component part of a coating plane that extends over the entire chip surface, so that the electronic semiconductor circuit can be applied to the coating plane by known semiconductor technology. A method for producing the micromechanical sensor as well as a microphone or a pressure sensor having the micromechanical sensor, are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.