Method of making substrate for use in forming image sensor package
US6358773B1 · kind B1 · utility
Inventors
Key dates
| Filing date | Dec 27, 2000 |
| Grant date | Mar 19, 2002 |
| Priority date | — |
| Expiry date | Dec 27, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48247
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate manufacturing method comprises the steps of: (a) providing a molding die including a top mold and a bottom mold, the bottom mold being provided with at least two projections each having a recess; (b) closing and clamping the molding die on a lead frame in a manner that a chip-supporting member is positioned in a molding cavity defined in the molding die wherein the chip-supporting member has portions respectively engaged with the recess of each projection thereby assuring that a chip-supporting surface of the chip-supporting member is parallel to the lead frame; (c) transferring a thermoplastic material into the molding cavity; (d) hardening the thermoplastic material; and (e) unclamping and opening the molding die to take out the molded product. In the substrate manufacturing method of the present invention, since the chip-supporting member are engaged and immobilized by the projections of the bottom mold, transferring of thermoplastic material during step (c) will substantially have no effect on the chip-support member thereby assuring that the chip-supporting surface of the chip-supporting member is parallel to the lead frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.