Adhesive for electroless plating and method of producing the same
US6359035B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 13, 2000 |
| Grant date | Mar 19, 2002 |
| Priority date | — |
| Expiry date | Apr 13, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0796
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
This adhesive for electroless plating can be produced without causing dust explosion and is excellent as an interlaminar resin insulating layer and is obtained by mixing an organic solvent dispersion of cured particles of heat resistant resin soluble or decomposable in an acid or an oxidizing agent with an uncured resin. The dispersion of the cured particles of the heat resistant resin in the organic solvent is obtained by dispersing cured particles formed in the production of heat resistant resin cured particles into the organic solvent without drying, and the uncured resin is a resin becoming hardly soluble in an acid or an oxidizing agent through curing treatment and capable of forming a heat resistant cured resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.