Multi-layer printed board
US6359237B1 · kind B1 · utility
12Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2000 |
| Grant date | Mar 19, 2002 |
| Priority date | — |
| Expiry date | Aug 14, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In order to reduce electromagnetic inductive interference due to power source current, in a multi-layer printed board on which a multiplicity of high-speed and high-frequency circuit elements are mounted, a multi-layer printed board has a construction such that on both upper and lower sides of a power source layer 1 provided with power source wiring 6, are laminated ground layers 2 via respective first insulating material layers 4, and on one or both of the upper and lower sides of these is laminated a signal layer 3 provided with signal wiring, via a second insulating material layer 5.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.