Hybrid chip process
US6360043B1 · kind B1 · utility
8Cited by
6References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 18, 1999 |
| Grant date | Mar 19, 2002 |
| Priority date | — |
| Expiry date | Oct 18, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4232
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present case concerns the manufacture of hybrid electrooptical chips. A substrate is treated so that it can both provide locations for electrooptical components and be etched so as to generate grooves in which optical fibers can be mounted. During the etching of the grooves any electrooptical component already mounted on the substrate is protected from damage by the etchant by a protective coating. A feature is that optical fibers can be mounted with their cores above the surface of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.