Method of making an upper housing for a bussed electrical center
US6360438B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2000 |
| Grant date | Mar 26, 2002 |
| Priority date | — |
| Expiry date | Oct 25, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4922
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An environmentally protected (sealed) BEC (10) at the upper and lower housing seams (16u, 16l) and at each of the connector receptacle (18a, 18b, 18c). A lower housing (14) of the BEC is formed conventionally, as for example by plastic injection molding and may carry a printed circuit board (PCB) (70), a spacer plate (72) and an electrical assemblage (74) including upstanding blade terminals (76). An upper housing (14) of the BEC is formed in two shots. Firstly, an upper housing body (14b) is formed by a plastic injection molding process using a first upper mold member (42) mated to a lower mold member (44). Next, the first upper mold member is removed, and a second upper mold member (52) is mated to the lower mold member. A liquid injection molding process now injects a resilient seal (silicone) over all mating surfaces of the upper housing body, including the upper housing seam (16u) and each connector receptacle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.