Method for processing semiconductor material
US6360755B1 · kind B1 · utility
7Cited by
5References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 28, 1999 |
| Grant date | Mar 26, 2002 |
| Priority date | — |
| Expiry date | Jul 28, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB02C2019/183
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method is for processing semiconductor material, in which one or more shock waves generated using a transducer are transmitted through a liquid medium to semiconductor material in rod form. The transducer is at a distance of from 1 cm to 100 cm from the semiconductor material, and the shock waves have a pulse energy of from 1 to 20 kJ and a pulse rise time to the energy maximum of from 1 to 5 &mgr;s.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.