Adhesive bonding laminates
US6361146B1 · kind B1 · utility
13Cited by
19References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 15, 1999 |
| Grant date | Mar 26, 2002 |
| Priority date | — |
| Expiry date | Jun 15, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0191
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An adhesive bonding laminate includes a first adhesive film that is capable of adhesively bonding to an epoxy coating and a second adhesive film that is capable of adhesively bonding to a stainless steel substrate. The first adhesive film is adhesively bonded to the second adhesive film. Ink jet printheads, ink jet print cartridges and methods of attaching a flexible circuit to a substrate employ the adhesive bonding laminate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.