Method and apparatus for rejuvenating a CMP chemical solution
US6362103B1 · kind B1 · utility
8Cited by
9References
18Claims
0Family size
Inventor
Key dates
| Filing date | Jan 18, 2000 |
| Grant date | Mar 26, 2002 |
| Priority date | — |
| Expiry date | Jan 18, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC02F2303/16
- WIPO fieldEnvironmental technology
- WIPO sectorChemistry
Abstract
A method and apparatus is disclosed for rejuvenating a chemical solution used in a first chemical mechanical planarization (CMP) process for reuse in a second CMP process. The steps of the method include using the chemical solution in the first process to remove material from a semiconductor device. An effluent is produced by this step that contains a dissolved first species removed from the semiconductor device. Then a second step of treating the effluent is performed to remove the dissolved first species to produce a rejuvenated chemical solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.