Polishing pad and polishing device
US6362107B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 8, 2001 |
| Grant date | Mar 26, 2002 |
| Priority date | — |
| Expiry date | May 8, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/959
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a polishing pad which is characterized in that it has a polishing layer of rubber A-type microhardness at least 80° and a cushioning layer of bulk modulus at least 40 MPa and tensile modulus in the range 0.1 MPa to 20 MPa, and to a polishing device which is characterized in that a semiconductor substrate is fixed to the polishing head, and an aforesaid polishing pad is fixed to the polishing platen so that the polishing layer faces the semiconductor substrate, and by rotating the aforesaid polishing head or the polishing platen, or both, the semiconductor substrate is polished.With the polishing device or polishing pad of the present invention for use in the mechanical planarizing process wherein the surface of the insulating layers or metal interconnects formed on a semiconductor substrate are smoothened, it is possible to uniformly planarize the entire semiconductor face and perform uniform polishing close up to the wafer edge and, furthermore, it is possible to provide a technique for achieving both uniformity and planarity under conditions of high platen rotation rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.