Curable composition
US6362301B1 · kind B1 · utility
7Cited by
9References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 1999 |
| Grant date | Mar 26, 2002 |
| Priority date | — |
| Expiry date | Oct 15, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F230/085
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a curable composition including an acryloxysilane- or acyloxysilane-containing oligomer prepared by a continuous process. In addition, photocurable composition including an alkoxysilane or acyloxysilane oligomer is provided. Methods are provided for curing the curable and photocurable compositions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.