Flexible printed circuit board
US6362433B1 · kind B1 · utility
7Cited by
5References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 4, 1999 |
| Grant date | Mar 26, 2002 |
| Priority date | — |
| Expiry date | Jun 4, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0577
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible printed circuit board that is intended to minimize curling is formed having a first polyimide-resin layer with a conductor pattern formed on one surface thereof and supporting that conductor pattern. A second polyimide-resin is formed on another surface of the conductor pattern and covers and protects the circuit of the conductor pattern. The polyimide-resin layers are chosen so that a difference between a coefficient of linear thermal expansion of the first polyimide-resin layer and the coefficient of linear thermal expansion of the second polyimide-resin layer is 3×10−6/K or smaller.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.