Method of etching transparent solid material with laser beam
US6362453B1 · kind B1 · utility
8Cited by
11References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 15, 1999 |
| Grant date | Mar 26, 2002 |
| Priority date | — |
| Expiry date | Mar 15, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of etching a surface of a transparent solid material with a laser beam, wherein the surface is irradiated with the laser beam having a fluence of 0.01-100 J/cm2/pulse while maintaining a fluid capable of absorbing the laser beam in contact with an opposite surface of the solid material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.