EMI containment assembly for an integrated circuit chip
US6362977B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2000 |
| Grant date | Mar 26, 2002 |
| Priority date | — |
| Expiry date | Apr 19, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0033
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An EMI containment assembly for an integrated circuit chip. A frame forms an eletrically conductive wall around the perimeter of the integrated circuit chip. The bottom of the frame makes an electrically conductive contact with a ground trace on the printed circuit board to which the chip is mounted. The top of the frame makes an electrically conductive contact with an electrically conductive heat removal assembly that is disposed over the top of the chip. An electrically conductive bolster plate is mounted on the side of the printed circuit board opposite the integrated circuit chip and is disposed beneath the chip. Because each component of the assembly is electrically conductive, the assembly creates an EMI cage around the integrated circuit chip. Because the frame does not cover the top of the chip, it does not interfere with a thermally conductive contact that is made between the top of the chip package and the heat removal assembly. The assembly of the invention not only provides containment of EMI generated by the integrated circuit chip in a light-weight and cost-effective manner, but it also enables the heat removal assembly to function as effectively as if no EMI containm…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.