Method for manufacturing a high density connector
US6363607B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 6, 1999 |
| Grant date | Apr 2, 2002 |
| Priority date | — |
| Expiry date | Oct 6, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a high density connector comprises five steps. The first step is to prepare essential elements of the connector, such as a dielectric cover, a metallic shell, a pair of guiding members and a plurality of contacts. Each contact is L-shaped and comprises a horizontal soldering portion. The second step is to first insert mold a pair of dielectric bases around the contacts to produce a contact subassembly. The three step is to second insert mold a dielectric housing around the contact subassembly to form a contact module. The forth step is to adjust the horizontal soldering portions of the contacts for ensuring a good coplanarity thereof. The fifth step is to assemble the contact module with the cover, the shell and the guiding members, thereby completing the connector. The method of the present invention can produce connection with high density contacts having good insert-molding qualities by double insert molding to form the contact module, resulting in the horizontal soldering sections of the contacts having good coplanarity and having good electrical communication quality.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.