Device and method for providing a true semiconductor die to external fiber optic cable connection
US6364542B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 2000 |
| Grant date | Apr 2, 2002 |
| Priority date | — |
| Expiry date | May 9, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4246
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A low cost device that provides a true die to external fiber optic connection. The device includes a semiconductor die having a first surface, an integrate circuit fabricated on the first surface of the semiconductor die and a package encapsulating the semiconductor die. The device also includes a module mounted onto the package and configured to receive an external fiber optic cable. An opto-electric device, housed in the module is optically coupled to the fiber optic cable when the cable is inserted into the module. To provide the direct die to external fiber optic connection, at least one electrical conductor is provided between the integrated circuit fabricated the semiconductor die, through the package and module, and directly to the opto-electrical device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.