Methods for controlling and/or measuring additive concentration in an electroplating bath
US6365033B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 1999 |
| Grant date | Apr 2, 2002 |
| Priority date | — |
| Expiry date | Aug 31, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N27/4161
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for measuring a target constituent of an electroplating solution using an electroanalytical technique is set forth in which the electroplating solution includes one or more constituents whose by-products skew an initial electrical response to an energy input of the electroanalytical technique. The method comprises a first step in which an electroanalytical measurement cycle of the target constituent is initiated by providing an energy input to a pair of electrodes disposed in the electroplating solution. The energy input to the pair of electrodes is provided for at least a predetermined time period corresponding to a time period in which the electroanalytical measurement cycle reaches a steady-state condition. In a subsequent step, an electroanalytical measurement of the energy output of the electroanalytical technique is taken after the electroanalytical measurement cycle has reached the steady-state condition. The electroanalytical measurement is then used to determine an amount of the target constituent in the electroplating solution. An automatic dosing system that includes the foregoing method and/or one or more known electroanalytical techniques in a close-loop syste…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.