Method for heat absorption using polyoxymethylene polymer compositions
US6365244B1 · kind B1 · utility
5Cited by
16References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 4, 1997 |
| Grant date | Apr 2, 2002 |
| Priority date | — |
| Expiry date | Nov 4, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1352
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides methods for heat absorption and thermally protected enclosures for containing heat sensitive devices, which include a heat absorption composition including polyoxymethylene polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.