Sensor device and method of producing a sensor device

US6365424B1 · kind B1 · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Klaus Bauer · Neuendettelsau, DE
• Josef Brem · Mindelheim, DE
• Ronald Henzinger · Regensburg, DE
• Markus Molin · Mintraching, DE
• Jörg Schindler · Neutraubling, DE

Key dates

• Filing date: Aug 17, 2000
• Grant date: Apr 2, 2002
• Expiry date: Aug 17, 2020

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/48091
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

One or more contact elements for transmitting calibration data during the calibration of a sensor of the sensor device are electrically connected to a signal processing unit of the sensor. The contact element has a contact region in a groove of a housing part of the sensor device. A sealing compound, which seals the contact region, is introduced into the groove and a cover is brought into contact with the sealing compound in the groove. The groove, the sealing compound, and the cover are configured and they interact in such a way that the chamber communicates only with a working medium which is to be sensed by the sensor.