Method of manufacturing a semiconductor device having data pads formed in scribed area
US6365443B1 · kind B1 · utility
28Cited by
9References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2000 |
| Grant date | Apr 2, 2002 |
| Priority date | — |
| Expiry date | Mar 30, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
On a semiconductor wafer, there are formed chip areas for storing memory areas, scribe areas for cutting the semiconductor wafer, pads for supplying electric signals from the outside in order to write data into the memory areas, and lead wires for electrically connecting the pads with the memory areas. The pads are formed within the scribe areas. After data has been written into the memory areas through the pads, the semiconductor wafer is cut along the scribe areas, thereby obtaining semiconductor chips. At the time of this cutting, the pads or the lead wires are cut.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.