Photo-curable resin composition used for photo-fabrication of three-dimensional object
US6365644B1 · kind B1 · utility
9Cited by
14References
14Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 13, 1999 |
| Grant date | Apr 2, 2002 |
| Priority date | — |
| Expiry date | Sep 13, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y10/00
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photocurable resin composition suitable for photo-fabrication. The resin composition capable of being promptly cured by photo-irradiation, thereby reducing fabricating time and providing cured products having excellent mechanical strength and minimized shrinkage during curing to ensure high dimensional accuracy. The composition includes (A) an oxetane compound, (B) an epoxy compound, and (C) a cationic photo-initiator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.