Method and device for treating work pieces with laser radiation
US6365870B1 · kind B1 · utility
11Cited by
3References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2000 |
| Grant date | Apr 2, 2002 |
| Priority date | — |
| Expiry date | Apr 7, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/0876
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for processing moving workpieces with laser radiation that is focused on a to-be-processed workpiece surface by means of a laser beam that is moved but not relative to the workpiece. The laser beam is focused in a line-like manner and its beam spot corresponds practically exclusively and with full a real coverage to the work piece surface to be processed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.