Flip-chip on flex for high performance packaging applications
US6365962B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2000 |
| Grant date | Apr 2, 2002 |
| Priority date | — |
| Expiry date | Mar 29, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4623
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
According to an embodiment of the invention, an integrated circuit (IC) package is provided that includes a flexible circuit board that has a first surface and a second surface. An integrated circuit mounted to the first surface of the flexible circuit board is provided. An electrical element is attached to the second surface of the flexible circuit board. Also, an encapsulant is attached to the flexible circuit board and the integrated circuit. The flexible circuit board includes at least one layer of dielectric that is no greater than approximately 35 microns thick. In another embodiment, the integrated circuit and the electrical element may be interchanged. A method is provided including attaching an encapsulant to an IC, forming a substrate from at least one layer of dielectric, attaching at least one electrical contact to the substrate, and attaching the substrate to the encapsulant so that the substrate is connected to the IC. Also, an electrical element may be attached with a flip-chip C4 (controlled collapsed chip connection) process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.