Flex circuit substrate for an integrated circuit package
US6365974B1 · kind B1 · utility
59Cited by
1References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2000 |
| Grant date | Apr 2, 2002 |
| Priority date | — |
| Expiry date | Mar 21, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1184
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A double sided electrical connection flexible circuit particularly useful as a substrate for an area array integrated package, and the method of fabricating the structure is described. A circuit having interconnections on one surface and solder ball contact pads on the second surface are interconnected by copper plated from a single surface in order to avoid entrapment of air pockets. In one embodiment, the conductive vias are formed from a copper film which extends from the solder ball contact pads, which may be indented, providing a well for solder balls in the contact pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.