Integrated circuit device with depressions for receiving solder balls and method of fabrication
US6365976B1 · kind B1 · utility
12Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2000 |
| Grant date | Apr 2, 2002 |
| Priority date | — |
| Expiry date | Feb 23, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device, especially a Ball Grid Array or Chip Scale Package, comprising an integrated circuit chip having at least one input/output terminal; a body of encapsulation material molded around said chip, forming a generally flat surface including at least one dimple having a suitable size and shape to receive a solder ball or solder paste; and said dimple having an electrically conductive solderable surface connected to said terminal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.