Thermally enhanced semiconductor ball grid array device and method of fabrication
US6365980B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2000 |
| Grant date | Apr 2, 2002 |
| Priority date | — |
| Expiry date | Feb 25, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device comprising a thermally conductive foil including a chip mount portion having first and second surfaces; an integrated circuit chip attached to said first surface; a body of encapsulation material molded around said chip and said first surface such that it leaves said second surface exposed; and said second surface comprising means for forming thermal contact, thereby creating a path for dissipating thermal energy from said chip. Said means for thermal contact comprise a configuration of said second surface suitable for direct thermal attachment to a heat sink. Alternatively, said means for thermal contact comprise a configuration of said second surface suitable for thermal attachment including solder balls between the chip and the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.