Vertical interconnect between coaxial or GCPW circuits and airline via compressible center conductors
US6366185B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2000 |
| Grant date | Apr 2, 2002 |
| Priority date | — |
| Expiry date | Jan 12, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P5/085
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An RF interconnect between an airline circuit including a dielectric substrate having a conductor trace formed on a first substrate surface and an RF circuit separated from the airline circuit by a separation distance. The RF interconnect includes a compressible conductor structure having an uncompressed length exceeding the separation distance, and a dielectric sleeve structure surrounding at least a portion of the uncompressed length of the compressible conductor structure. The RF interconnect structure is disposed between the substrate and the RF circuit such that the compressible conductor is placed under compression between the substrate and the RF circuit. Examples of the RF circuit include a vertical coaxial transmission line or a grounded coplanar waveguide circuit disposed in parallel with the airline circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.