Method and apparatus for overmolded antenna
US6366261B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2000 |
| Grant date | Apr 2, 2002 |
| Priority date | — |
| Expiry date | Sep 8, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q9/0407
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A generally planer antenna structure for connecting to a transceiver is provided with the antenna structure having a printed circuit board including a radiating element etched or fabricated thereon. The printed circuit board and radiating element are thereafter encapsulated within an overmolded sheath which provides a protective enclosure for the antenna elements while maintaining the desirable thin profile of the generally planer antenna structure. The antenna structure is created by forming a printed circuit board having the overall general desirable dimensions and affixing thereto a radiating element capable of propagating and receiving the desirable frequency spectrum. The printed circuit board and radiating element are insert injection molded to form the overmolded sheath thereabout. A portion of the printed circuit board having an interface connector for the transceiver is enclosed using a multi-piece housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.