Electronic module with integral refrigerant evaporator assembly and control system therefore
US6366462B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2000 |
| Grant date | Apr 2, 2002 |
| Priority date | — |
| Expiry date | Jul 18, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S165/908
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic module is provided having an integrated refrigerant evaporator assembly coupled to a closed-cycle cooling system, as well as a method for controlling the system. The module and integrated assembly includes a plurality of integrated circuit chips arrayed on a substrate. The evaporator assembly is disposed over the chips and substrate such that a chamber is formed between the assembly and the substrate within which the chips reside. A lower plate of the assembly has a plurality of jet orifices which direct coolant onto individual chips of the plurality of chips arrayed on the substrate. In addition, the lower plate includes a plurality of channels formed between at least some of the jet orifices. The plurality of channels remove coolant from the chamber after the coolant has been heated by impinging upon the integrated circuit chips. A control system is provided to prevent excessive pressure from building up within the assembly at startup and shutdown of the closed-cycle cooling system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.