Method and apparatus for measuring surface shape of thin element
US6367159B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 1999 |
| Grant date | Apr 9, 2002 |
| Priority date | — |
| Expiry date | Mar 30, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B21/08
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Method for measuring the surface shape of a thin element such as a silicon wafer measures the surface shapes of one surface and the other surface of the thin element by independently measuring the distance each to one surface and to the other surface of the thin element by rotating or moving the thin element within a single plane and independently moving the first and second measuring means along the first and second guide shafts. Apparatus for measuring the surface shape of the thin element measures the surface shapes of one surface and the other surface of the thin element by rotating or moving the thin element supported within the same plane by a supporting means, and independently measuring the distance each to one surface and to the other surface of the thin element by the first and second measuring means while independently moving the first and second sliders along the first and second guide shafts. The method measures the thickness of each part of the thin element based on the surface shapes of one surface and the other surface of the thin element as measured by the method for measuring the surface shape of the thin element and the distance between the first and second measu…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.