Wave solder apparatus and method
US6367677B1 · kind B1 · utility
7Cited by
24References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2000 |
| Grant date | Apr 9, 2002 |
| Priority date | — |
| Expiry date | Sep 28, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K3/0653
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wave soldering apparatus includes a frame having a first end and wave solder equipment supported with respect to the frame. The wave solder equipment is configured to apply solder to a circuit board. A circuit board transporter is supported with respect to the frame, and is configured to receive a circuit board adjacent the first end of the frame, to move the circuit board away from the first end of the frame and over the wave solder equipment which applies solder to the circuit board, and to return the circuit board for retrieval adjacent the first end of the frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.