Metal-base multilayer circuit substrate with heat conducting adhesive
US6369332B1 · kind B1 · utility
15Cited by
16References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2000 |
| Grant date | Apr 9, 2002 |
| Priority date | — |
| Expiry date | Jun 13, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10166
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A metal-base multilayer circuit substrate which includes a metal plate and a circuit substrate bonded thereon by a first insulating adhesive layer containing at least one of metal oxides and/or at least one of metal nitrides with a heat resistance of at most 2.5° C./W.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.