Semiconductor component
US6369435B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 16, 1999 |
| Grant date | Apr 9, 2002 |
| Priority date | — |
| Expiry date | Nov 16, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/147
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor component (1) has a pressure sensor and a semiconductor chip (2) with a semiconductor structure (3) for at least one additional function of the semiconductor component (1). The semiconductor chip (2) is connected to a casing (5) by means of an elastic carrier arrangement (4) and can be deflected relative to the casing (5) against the restoring force of the material of the carrier arrangement (4) on the whole. For indirect measurement of a pressure acting on the semiconductor chip (2) and causing the deflection of the semiconductor chip (2), at least one position sensor that works together with the semiconductor chip (2) is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.