Low profile dipole antenna for use in wireless communications systems
US6369771B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2001 |
| Grant date | Apr 9, 2002 |
| Priority date | — |
| Expiry date | Jan 31, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q9/28
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A dipole antenna for use with a mobile subscriber unit in a wireless network communications system. The antenna is fabricated with printed circuit board (PCB) photo-etching techniques for precise control of the printed structure. The dipole antenna includes a planar substrate made of dielectric material. A conductive planar element is layered on one side of the substrate in an upper region of the substrate, and a conductive planar ground patch is layered on the other side of the substrate in a lower region of the substrate. That is, the conductive planar element is stacked above the conductive planar ground patch. A feed strip is connected to the bottom of the conductive planar element, and extends from the element to a bottom edge of the substrate and terminates at a bottom feed point. Typically, the feed point is connected to a transmission line for transmitting signals to and receiving signals from the dipole antenna. The conductive planar ground patch includes a bottom end for connecting the ground patch to a ground plane upon which the dipole antenna is mounted. The ground plane is aligned orthonormal to the antenna. Capacitive coupling between the conductive planar element an…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.