Capacitor laminate for use in printed circuit board and as an interconnector
US6370012B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2000 |
| Grant date | Apr 9, 2002 |
| Priority date | — |
| Expiry date | Aug 30, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0315
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A parallel capacitor structure capable of forming an internal part of a larger circuit board or the like structure to provide capacitance therefore. Alternatively, the capacitor may be used as an interconnector to interconnect two different electronic components (e.g., chip carriers, circuit boards, and even semiconductor chips) while still providing desired levels of capacitance for one or more of said components. The capacitor includes at least one internal conductive layer, two additional conductor layers added on opposite sides of the internal conductor, and inorganic dielectric material (preferably an oxide layer on the second conductor layer's outer surfaces or a suitable dielectric material such as barium titanate applied to the second conductor layers). Further, the capacitor includes outer conductor layers atop the inorganic dielectric material, thus forming a parallel capacitor between the internal and added conductive layers and the outer conductors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.