Heater block cooling system for wafer processing apparatus
US6370796B1 · kind B1 · utility
Assignees
Inventor
Key dates
| Filing date | Sep 29, 2000 |
| Grant date | Apr 16, 2002 |
| Priority date | — |
| Expiry date | Sep 29, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling system and method are provided for cooling a heater block located in a cylindrical processing chamber of a wafer processing apparatus. The cooling system includes first and second frame assemblies having respective ends adapted to rest on an upper peripheral surface of the processing chamber, and fan assemblies mounted to the frame assemblies at spaced locations therealong. A first pair of fan assemblies are directed to push air into the processing chamber, and a second pair of fan assemblies are directed to pull air out of the processing chamber. The fan assemblies are arranged such that they circulate ambient air through the processing chamber to provide a rapid cooling of the heater block to a safe working temperature. The frame assemblies have an adjustable length that can be adjusted to fit processing chambers having different sizes and configurations. The cooling system substantially reduces the cooling time required for the heater block to reach a safe working temperature as compared to conventional cooling by free convection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.