Die molding apparatus for resin article
US6371747B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2000 |
| Grant date | Apr 16, 2002 |
| Priority date | — |
| Expiry date | Mar 22, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3029
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
In a die molding apparatus for molding resin articles having a plurality of molds for forming a cavity in communication with an injection gate and a gas charging nozzle capable of charging the inside of the cavity with a gas after the completion of resin injection to form a resin article having a hollow inside, an overflow portion for relieving an excess molten resin and a film gate for communication between the main cavity portion and the overflow portion are formed between a pair of molds forming the other end of the cavity, and the gap between both of molds is set to 1.5 mm or less at the film gate; the gas charging nozzle is situated in the cavity with a gas charging hole being positioned in the cavity; and a hole-sealed hollow cylinder is formed between one of molds and the gas charging nozzle, the hole-sealed hollow cylinder having an inner surface shape defined by the outer surface of the cylindrical small diameter portion and the step and an outer surface shape defined by the inner surface of the insertion hole of the gas charging nozzle provided the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.