High density interconnect system and method
US6371773B1 · kind B1 · utility
146Cited by
4References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2001 |
| Grant date | Apr 16, 2002 |
| Priority date | — |
| Expiry date | Mar 23, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/6587
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrical interconnect system allows high signal density with means of electrical isolation to minimize degradation of electrical signals. The electrical interconnect system includes signal conductors which are surrounded by multiple reference or ground conductors, a given signal conductor for example surrounded by four reference conductors. The interconnect system includes a reference element with two sets of reference conductors, one of the sets offset a distance from the other set.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.