ZIF memory module assembly
US6371781B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2000 |
| Grant date | Apr 16, 2002 |
| Priority date | — |
| Expiry date | Sep 1, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/87
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An enhanced memory module assembly comprises a memory module including a substrate with a plurality of conductive traces arranged in an edge thereof. A connector includes a first housing having a memory module receiving slot extending along a longitudinal direction thereof. The housing further defines a plurality of terminal cells with a plurality of first terminals assembled therein. Each terminal includes a first end extending into the elongate slot for electrically contacting with the conductive traces. A ZIF device is arranged between the memory module and includes a pair of actuator receiving slots located in the housing and in communicating with the terminal cells, and an actuator attached to the memory module. The actuator includes a pair of actuating plates extending into the actuator receiving slots thereby pushing the terminals in electrical contact with the conductive traces when the memory module is completely inserted therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.