Socket for electrical parts and method of assembling the same
US6371783B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 1999 |
| Grant date | Apr 16, 2002 |
| Priority date | — |
| Expiry date | Jun 30, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1007
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a socket for an IC package as an electrical part, the IC package is mounted on a mount surface of a top plate mounted on a socket body of the socket. A number of contact pins are arranged to the socket body to be contacted to or separated from solder balls of the IC package. A slide plate is disposed to the socket body so as to be movable with respect to the socket body. Each of the contact pins has a pair of elastic pieces formed at front end portions thereof with a pair of contact portions, each of the paired contact portions of the paired elastic pieces being opened or closed in accordance with the movement of the slide plate so as to clamp the solder balls of the IC package thereby electrically being connected thereto. A pre-load plate is located to press a middle portion of the elastic piece of the contact pin arranged to the socket body so as to elastically deform the middle portion thereof along a direction in that the paired contact portions are close to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.