Process for promoting adhesion between an inorganic substrate and an organic polymer
US6372027B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 2000 |
| Grant date | Apr 16, 2002 |
| Priority date | — |
| Expiry date | May 31, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C2222/20
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to a process, and compositions for its implementation, to promote adhesion between an inorganic substrate and an organic polymer, especially between the copper surfaces of printed circuits for electronic use and a polymer resin, in which an organometallic layer of a dark brown colour, which is very uniform and compact, is deposited on the inorganic substrate by means of treatment in a composition which comprises:a) a silane or a mixture of functional organic silanes with a structure represented by the following general formula: Y—(CH2)n—Si(OR)3 where: Y represents a functional organic group, n is a number which has a value between 0 and 3, and R represents a hydrogen atom or any easily hydrolysable group which is capable of releasing an atom of hydrogenb) an azole compound;c) an oxygen carrier;d) an organic or inorganic acid; and preferablye) a zinc compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.