Method for replenishing baths
US6372055B1 · kind B1 · utility
2Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2000 |
| Grant date | Apr 16, 2002 |
| Priority date | — |
| Expiry date | Feb 23, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/383
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed are methods for replenishing adhesion promoting baths from an unstable state without discarding the bath. Methods of adhesion promoting substrates, such as printed wiring boards, using the replenished baths are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.