Method and apparatus for reclaiming a metal from a CMP process for use in an electroplating process
US6372111B1 · kind B1 · utility
Inventor
Key dates
| Filing date | Feb 22, 2000 |
| Grant date | Apr 16, 2002 |
| Priority date | — |
| Expiry date | Feb 22, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC02F2303/16
- WIPO fieldEnvironmental technology
- WIPO sectorChemistry
Abstract
A method and apparatus is disclosed for reclaiming a metal from the effluent of a chemical mechanical planarization (CMP) process and using the reclaimed metal in an electroplating process. The steps of the method include using a chemical solution in a CMP process to remove material from a semiconductor device. An effluent is produced by this step that contains a dissolved first species removed from the semiconductor device. Then a second step of treating the effluent is performed to remove the dissolved first species and to produce a reclaimed metal. Then a third step of using the metal in an electroplating process is performed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.