Thermally conductive grease composition and semiconductor device using the same
US6372337B1 · kind B1 · utility
37Cited by
13References
16Claims
0Family size
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Key dates
| Filing date | May 26, 1999 |
| Grant date | Apr 16, 2002 |
| Priority date | — |
| Expiry date | May 26, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31544
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A grease composition having high thermal conductivity and excellent dispensation suitability, comprising (A) 100 parts by weight of a base oil and (B) 500 to 1,200 parts by weight of metallic aluminum powder having the average particle size in the range of 0.5-50 &mgr;m; wherein the aluminum powder is a mixture of fine metallic aluminum powder having an average size of 0.5 to 5 &mgr;m and coarse metallic aluminum powder having an average particle size of 10 to 40 &mgr;m; and a semiconductor device utilizing the aforesaid grease composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.