Method of fabricating a microcircuit card
US6372541B1 · kind B1 · utility
11Cited by
2References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 4, 2000 |
| Grant date | Apr 16, 2002 |
| Priority date | — |
| Expiry date | May 4, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/964
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a microcircuit card provides better control of the spreading of a hardenable coating material during fabrication of the microcircuit card. The surface of a support is treated to define at least two areas with different surface states and both extending beyond a predetermined location of the microcircuit. The deposit of the material is delimited by the configuration of these areas. The treatment is preferably applied by means of a laser beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.