Method of component manufacture
US6372542B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2000 |
| Grant date | Apr 16, 2002 |
| Priority date | — |
| Expiry date | Oct 19, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4246
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention relates to a method of producing an electric, electronic, electromechanical and/or mechanical component (12), where the component substrate is given a three-dimensional structure (3″) or configuration, and where said substrate is adapted for further treatment or processing to form the component (12). The substrate is formed by shaping said substrate against a die or mold, such as by molding, pressing, extruding or embossing said substrate, wherewith the precision necessary with respect to said component in the three-dimensional structure is achieved by means of a micromechanical working process when producing the die or mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.