Separating method, method for transferring thin film device, thin film device, thin film integrated circuit device, and liquid crystal display device manufactured by using the transferring method
US6372608B1 · kind B1 · utility
902Cited by
3References
78Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 24, 1998 |
| Grant date | Apr 16, 2002 |
| Priority date | — |
| Expiry date | Apr 24, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/6758
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for transferring a thin film device on a substrate onto a transfer member, includes a step for forming a separation layer on the substrate, a step for forming a transferred layer including the thin film device on the separation layer, a step for adhering the transferred layer including the thin film device to the transfer member with an adhesive layer therebetween, a step for irradiating the separation layer with light so as to form internal and/or interfacial exfoliation of the separation layer, and a step for detaching the substrate from the separation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.